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- 17 Mar 2014
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IC-DIAMOND CREATES A GASKET-LIKE SEAL
This thread is a WORK IN PROGRESS, so please bare with us
(photos to arrive soon)
We have had some rather interesting feedback about ICD Diamond creating a square like stain where the CPU Block and IHS meet.
This is not the above but an ADDED effect of IC-DIAMOND. What you call a stain is rather the oxydisation effect of the Thermal compound. We like to call it the 'Overclockers Patina' (lovely Marketing word there)
There is no effect in the centre of the block, however around the outside edges we see a thin black line, thus the oxydisation effect we were mentioning earlier.
[
We made an 'oven' sample to accelerate what would happen to the copper naturally block over time.
When air is introduced into the joint of any two surfaces then the efficiency of the Thermal Compound will be greatly reduced
The higher the viscosity of the TIM, the better to create a gasket-like seal around the CPU BLOCK.
So this oxydisation effect is actually a GOOD thing, as it shows that no air is getting into the contact area and thus drying out the compound and or reducing efficiency.
Thus any TIM pushed to the edges where there is an extreme amount of pressure will create as seal if the thickness of the TIM is right.
When removing the CPU block, just give a slight twist and pull.
Removing the compound:
Simply apply your chosen cleaning solution and allow it to soak in then wipe (DO NOT SCRUB) the TIM from the IHS and viola one perfectly clean CPU IHS with no staining.
REMOVING the Oxydisation effect.
Good old Lemon juice and Vinegar is one option.
thread is a work in progress
This thread is a WORK IN PROGRESS, so please bare with us
(photos to arrive soon)
We have had some rather interesting feedback about ICD Diamond creating a square like stain where the CPU Block and IHS meet.
This is not the above but an ADDED effect of IC-DIAMOND. What you call a stain is rather the oxydisation effect of the Thermal compound. We like to call it the 'Overclockers Patina' (lovely Marketing word there)
There is no effect in the centre of the block, however around the outside edges we see a thin black line, thus the oxydisation effect we were mentioning earlier.
[
We made an 'oven' sample to accelerate what would happen to the copper naturally block over time.
When air is introduced into the joint of any two surfaces then the efficiency of the Thermal Compound will be greatly reduced
The higher the viscosity of the TIM, the better to create a gasket-like seal around the CPU BLOCK.
So this oxydisation effect is actually a GOOD thing, as it shows that no air is getting into the contact area and thus drying out the compound and or reducing efficiency.
Thus any TIM pushed to the edges where there is an extreme amount of pressure will create as seal if the thickness of the TIM is right.
When removing the CPU block, just give a slight twist and pull.
Removing the compound:
Simply apply your chosen cleaning solution and allow it to soak in then wipe (DO NOT SCRUB) the TIM from the IHS and viola one perfectly clean CPU IHS with no staining.
REMOVING the Oxydisation effect.
Good old Lemon juice and Vinegar is one option.
thread is a work in progress