Since I got it in late 2020, I had to power limit it to prevent the memory overheating (common problem), after the warranty expired I started looking into how to fix it, over last few months I've tried repasting/padding it 4 times, the memory temps are very good now (max 80C) but avg/hotspot keeps maxing out at 90C/100C respectively, the delta is 10-11C.
In 3dMark Steel Nomad I get ~4500 (apparently average is at least 5000). In heaven I also get ~10% bellow average as well.
1st time - MX-4 and ThermalRight Odyssey 1.5mm pads.
2nd time - ThermalRight TFXand Gelid Extreme 1.5/2mm front side, Gelid Ultimate 1.5mm on back side.
3rd time - PTM7950 and Gelid Extreme 1.5/2mm front side, Gelid Ultimate 1.5mm on back side.
4th time - PTM7950 and Gelid Extreme 1.5mm front side, Gelid Ultimate 1.5mm on back side.
Using this tutorial: https://www.reddit.com/r/nvidia/comments/mmzri2/3090_fe_thermal_pad_mod_cutting_template/
Also watched loads of video on how to paste, apply ptm correctly, made sure to remove plastic film off pads before applying, carefully align pcb when putting back together etc.
The temps shown after others repaste/repad show avg/hotspot in 60's and memory around 80C so I think either I am doing something wrong, missed something or maybe the vapor chamber has failed? Any ideas?
CPU: 9800X3D
RAM: 64GB DDR5-6000
In 3dMark Steel Nomad I get ~4500 (apparently average is at least 5000). In heaven I also get ~10% bellow average as well.
1st time - MX-4 and ThermalRight Odyssey 1.5mm pads.
2nd time - ThermalRight TFXand Gelid Extreme 1.5/2mm front side, Gelid Ultimate 1.5mm on back side.
3rd time - PTM7950 and Gelid Extreme 1.5/2mm front side, Gelid Ultimate 1.5mm on back side.
4th time - PTM7950 and Gelid Extreme 1.5mm front side, Gelid Ultimate 1.5mm on back side.
Using this tutorial: https://www.reddit.com/r/nvidia/comments/mmzri2/3090_fe_thermal_pad_mod_cutting_template/
Also watched loads of video on how to paste, apply ptm correctly, made sure to remove plastic film off pads before applying, carefully align pcb when putting back together etc.
The temps shown after others repaste/repad show avg/hotspot in 60's and memory around 80C so I think either I am doing something wrong, missed something or maybe the vapor chamber has failed? Any ideas?
CPU: 9800X3D
RAM: 64GB DDR5-6000
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