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3M To play a large part in the future of CPUs?

Gundog48

Gundog48

Gundog48

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Yes, you heard it right- 3M! IBM has been working with 3M to develop a new heat-dissipating adhesive that could be used to 'glue' silicon chips together to create a silicon 'brick'. They have said that it is possible to stack 1000 chips with the equivalent power of a normal CPU which they have crudely calculated as being 1000 times faster. Interesting stuff, but will it actually work? Will it be able to deal with heat well enough? That is yet to be seen.

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