AMD granted a glass substrate patent to revolutionize chip packaging

[humbug]

AMD don't own any fabs, they no longer manufacture chips, but they used to, back in the day they were the No 2 fab behind Intel, AMD sold their fabs for two reasons, one to become more agile and two at a time where AMD was struggling to raise capital.
Tho despite this AMD never let go of its chip making expertise, not entirely, some of TSMC's success is due to AMD's expertise, the advanced packaging technology TSMC have and AMD use was developed by AMD.

With that said AMD have just patented new packaging technology, Glass Substrate Technology.

Glass substrates are made from materials like borosilicate, quartz, and fused silica, which provide notable benefits compared to traditional organic materials as they feature exceptional flatness, dimensional stability, and superior thermal and mechanical stability. Superior flatness and dimensional stability can improve lithography focus for ultra-dense interconnects in advanced system-in-packages, whereas superior thermal and mechanical stability makes them more reliable for high-temperature, heavy-duty applications like data center processors.

AMD have contributed quite a lot to this sector over the last 50 years, i'm glag they pulled themselves out of their rut to continue.

Its a shame they have zero involvement in fabs now, with the US wanting to make chips at home they could benefit from AMD having a stake in that, this technology is likely to end up with TSMC again bolstering their capability portfolio even more.

MSN

 

[CAT-THE-FIFTH]

AMD own their packaging plants:

AMD set to Open Manufacturing Plant in Malaysia in Early 2023

AMD's Malaysian joint venture, TF-AMD Microelectronics is in the middle of the construction of a US$452 million manufacturing plant on the island of Penang off the west coast of Malaysia. The facility itself is said to cover 139,000 square metres and is said to create some 3,000 jobs related to...

www.techpowerup.com

 

[humbug]

AMD own their packaging plants:

AMD set to Open Manufacturing Plant in Malaysia in Early 2023

AMD's Malaysian joint venture, TF-AMD Microelectronics is in the middle of the construction of a US$452 million manufacturing plant on the island of Penang off the west coast of Malaysia. The facility itself is said to cover 139,000 square metres and is said to create some 3,000 jobs related to...

www.techpowerup.com

So that's pretty cool, all the more reason to talk to AMD, advanced fabrication is nothing without advanced packaging.

 

[SpellowHouse]

I've heard of this before.

Apparently would solve the problem NVIDIA are having with their latest GPU's, of the substrate distorting when the GPU is under load.

 

[pete910]

Apparently would solve the problem NVIDIA are having with their latest GPU's, of the substrate distorting when the GPU is under load.

Jensen needs to stop putting his wallet on them then !

 

[SpellowHouse]

Jensen needs to stop putting his wallet on them then !

Interestingly, it is apparently the same problem as the high-end chips for data centres are having too. They are bending, presumably under the weight of success.