Anyone tried CooLaboratory LIQUID Pro..??

z10m · 20 Feb 2009 at 12:05

I just applied that thermal compound on my CPU and WOW..!! lowered CPU temps by 5C compared to Arctic Silver 5.!!! C'mon OCUK.!! You shoud have it in your shop.!!

gurusan · 20 Feb 2009 at 12:16

It's good stuff but removing it is tricky....also sort of brazes the CPU to the HSF, very annoying.

z10m · 20 Feb 2009 at 12:20

i did not try to remove it yet, hope it wont be to hard when i will have to

MikeTimbers · 20 Feb 2009 at 12:25

Stock response to threads of this type.

So the abolute only thing that got changed was the goop? You didn't clean the heatsink? Of the case filters? How many times did you mount the heatsink with AS5 compared to the new goop?

Are you aware that a good mount compared to a bad mount can make up to ten degrees C difference?

You're kidding yourself if you think a thin layer of TIM can make that much difference. Read the review linked earlier and see an objective (if old) test from a guy who has tested more heatsinks than probably anyone on the web.

shadowscotland · 20 Feb 2009 at 12:41

it does work well with everything - check out the compatibility list here

Notable 'unsuitable' HS inc Xigmatek HDT-S1283
and many of the Zalman's/Noctua/scythe are less that optimal.

Thermalright - Oh yes, now we're talking - but as gurusan said removal from optimal HS is a pain. The liquid metal pad could be a good alturnative (but they don't recomened it for Watercooling)

Edit: Very good point mike, but the ability to get it right first time is easier with some TIM than others.

Edit: It eats aluminum - and bonds very strongly with copper (less with nickel) so if you lapped your ISH/HS beware

z10m · 20 Feb 2009 at 13:28

im using it with watercooling OCZ Hydroflow. and I have mounted woterblock couple of times with AS5 always with the same resoult and with this one after first attempt temps are 5c lower.!!

shadowscotland · 20 Feb 2009 at 15:43

Did you do the whole 10-15min application process, double clean - spread & smooth - etc, etc.

Also to others - this stuff is very conductive, use with extreme care.

z10m · 20 Feb 2009 at 16:53

yes it took quite a long time. also spreding it over cpu is a bit difficult but its worth it.

Monkey Puzzle · 20 Feb 2009 at 20:00

shadowscotland said:
Edit: It eats aluminum - and bonds very strongly with copper (less with nickel) so if you lapped your ISH/HS beware

That doesn't sound ideal. so does it utterly ruin the surface once you've prized it off?

shadowscotland · 23 Feb 2009 at 11:14

It's not ideal but they do warn you (even on the tube) haveing water in a pc isn't ideal but there are ways to manage it, it's no different, just care and attention is required.

Surface of copper/nickle is fine, thin buildup over surface possable after many weeks - lap or use braso to full remove. Will hide etched spec on chip surface if unlapped.

Further reading has lead me to beleive that the removal (especially of lapped HS) is due to surface tension of the liquid metal on very flat surfaces. Twisting action is recomended removal technic.

Can reapply with LP without issue I'm told, but not used it myself so read up fully if you going use this stuff.