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Applying Thermal Compound the correct way?

incubation

incubation

incubation

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26 Jul 2010
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321
In the past I've always applied the compound then used my credit card to spread the compound as evenly as possible on the CPU before mounting the HS & cooler but I've read that applying a pea sized amount directly to the centre of the CPU (without spreading) then mounting the HS & cooler will result in a better contact between the to and could result in lower temps as the mounting spreads the compound more evenly.

Which method is better? does the none spread method actually work better? or should I just stick with my tried and tested spreading method?
 
I've used the credit card method because I can control where the paste goes. I've heard this doesn't necessarily give the best heat transfer because it can trap air bubbles - I don't know if that's true as it's always worked fine. I saw this done with a finger in a plastic bag which seemed to work well.

Some peeps recommend the pea method because it avoids air bubbles. It doesn't seem worth it - as the paste can go anywhere/everywhere if you don't use the right amount or it doesn't spread as you expect.

Lately I've been using the Freezer 7 Pro Rev 2 - which comes with thermal paste applied - works fine.
 
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I'd say the pea method is best as it makes sure the compound is being applied directly to the core and reduces the possibility of applying too much and seeping out as a result.


Take this with a pinch of salt, he might of not been applying the same amount of pressure each time.
 
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Everyone has there own methods i either use a credit card or cling film over the finger ,never had a problem with temps.
 
Cheers for the feedback and those very helpfull videos, I think looking at that the spread method I use isn't the best, looking like the pea method gives a even spread minus air bubbles and covers the core quite well without excess compound sneaking out the sides, again cheers :)
 
I use credit card method too and I have never had temp issues on cpus or gpus. I always prefer this method as I can be sure it has spread evenly and nicely where as you can't with the pea method. No one method is the wrong or correct though really, its each to their own.
 
Funny thing is though, unless you've lapped your CPU and heatsink perfectly, spread it evenly and put the heatsink on cleanly, there'll still be air bubbles. Even worse if you have an unlapped CPU. I always found Core 2 CPU heatspreaders to be far from flat!

The best method is a blob in the middle and letting it spread by itself, filling in all gaps and account for all imperfections. Just make sure you put enough on, and that your heatsink pressure is high enough. The exact details of that will depend on the type of compound you're using.
 
I normally cover the whole heat spreader as I lap the processor and heatsink. It would be nice to see the temp difference between each method.

MW
 
alexhull24 said:
The best method is a blob in the middle and letting it spread by itself, filling in all gaps and account for all imperfections. Just make sure you put enough on, and that your heatsink pressure is high enough. The exact details of that will depend on the type of compound you're using.
Click to expand...

+1

Tinting both surfaces after cleaning is very effective at minimising air bubbles as it fills the microscopic valleys, I use a good-sized blob in the centre & the 70lb screws that came with my super mega give good pressure.
 
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