Associate
- Joined
- 26 Jul 2010
- Posts
- 321
In the past I've always applied the compound then used my credit card to spread the compound as evenly as possible on the CPU before mounting the HS & cooler but I've read that applying a pea sized amount directly to the centre of the CPU (without spreading) then mounting the HS & cooler will result in a better contact between the to and could result in lower temps as the mounting spreads the compound more evenly.
Which method is better? does the none spread method actually work better? or should I just stick with my tried and tested spreading method?
Which method is better? does the none spread method actually work better? or should I just stick with my tried and tested spreading method?