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Applying Thermal Compound to GPU

I didn't spread on the cpu, but I did on my gpu (see below) because I think it's more necessary to cover the whole gpu core.

mx2w.jpg
 
I do the same as I do for a CPU, a small blob and then use a piece of laminated card (edge of packaging etc) to spread it thinly and evenly over the whole core. The laminated card works well as it glides but isnt so rigid it doesnt let the paste smooth out properly.

Thats using AS-5.
 
Hey, I'm not going to argue, I've told You Mechanically what the compound is there for, Use what ever You want

I don't think anyone is arguing about the applied thickness - just describing the different viscosity of the products.

I'm convinced that MX-3 has better thermal properties because I've read the reviews - that is why I bought it and I will use it when I seat my CPUs in a couple of weeks time.

But when it comes to the spreading method, MX-3 doesn't work too well. If you get a small blog of it and try to smear it with a razer blade then it tends to ball up, sticking to iteslef and to the blade. By comparison AS-5 smears very smoothly.

My conclusion is that MX-3 has better thermal properties but needs to be applied using the compression method (rice grain or line). For GPUs, I'm not confident that full coverage is not needed so my preference is to use AS-5.

I did get a reply back from Arctic Silver (very promptly - well impressed) and they too implied that full coverage is required for GPU and suggested using a circle of MX-3 rather than a blob in the centre - my concern with that would be to form a circle may mean putting too much compound on.

Perhaps 3 thin lines (as suggested above) or 9 small dots would work.

Cheers,

Nigel
 
You really shouldn't ever spread paste on an IHS or on a die....

A small blob in the middle and swivel down the heatsink will seat it properly with no air bubbles. I've done dozens of GPUs like this and it works perfectly every time.
 
A small blob in the middle and swivel down the heatsink will seat it properly with no air bubbles.

But as I said in the original post, I can't twist\swivel the heatsink because it's 4 mounting lugs go through the PCB. I beleive this is quite a common design with GPU HSFs.

Cheers,

Nigel
 
One thing we did not mention and overlooked was, MX-2, I think We all agree is more viscous, So will work better on poorly finished bad fitting Heatsinks than AS5
 
I've not tried MX-3, but I do find that MX-2 is not the easiest to spread either. Once I've done a basic spread, if I then try to smooth it out and cover any gaps, it tends to be difficult, sometimes pulling itself away from the area I'm trying to keep it spread out over, at least, more difficult than the akasa paste I used to use.
 
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