Artic silver 5 vs Arctic ceramique

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I have both of these and wondered which is the best to use . Does anyone know of a review that compares them against each other ?

currently on the ceramique and wondering if its worth the bother to change over to the silver 5.


thank you
 
I have both of them and would like to know if there are any reviews that compare them against each other .i know that they will both do the job . but the thing is i would like to know which one is better !

cheers
 
There are a shedload of reviews over at Arctic Silver's Website

Might be worth checking them out. Not sure if any compare it to AS5, but there are a few comparing it to AS3. Seems to be about 1C better in most cases than AS3 and as AS5 is meant to be better than AS3, I'd assume that AS5 would be the best one to go for:)
 
I been reading a few horror stories about AS5 where after it has been applied and has time to set it forms a semi-permanent bond to the base of the heatsink. When people are removing the heatsink this bond is so strong that its pulling the CPU straight out of the socket and bending pins!

This just happened to my mate when removing his XP-120, pulled his Opteron clean from the socket! :eek:
 
Big.Wayne said:
I been reading a few horror stories about AS5 where after it has been applied and has time to set it forms a semi-permanent bond to the base of the heatsink. When people are removing the heatsink this bond is so strong that its pulling the CPU straight out of the socket and bending pins!

This just happened to my mate when removing his XP-120, pulled his Opteron clean from the socket! :eek:

The AS5 will form a bond, like most TIM's. It's usually advisable to run the cpu for 10 or so minutes before removing a heat sink to heat the TIM and make the heatsink easier to remove.
 
Big.Wayne said:
I been reading a few horror stories about AS5 where after it has been applied and has time to set it forms a semi-permanent bond to the base of the heatsink. When people are removing the heatsink this bond is so strong that its pulling the CPU straight out of the socket and bending pins!

I had that happen to me with my old 3500... Had just sold it and was taking it out to stick my new one in. Stuck to the bottom of the heatsink and pulled out with it! Bent a few pins but I managed to bend them back and it still worked fine. Sold it on and haven't heard anything bad back from the person so all is good:)
 
I always use as5, read a couple of reviews from back when it first came out! been using it since on all the systems i build, as said though it does tend to cling after a while but I usually find theres enough play to twist the HSF back & forth a few times enough to break it's bond on the chip, though wouldnt twist it off on an IHS less cpu or an XP though.

Anyway back on topic i doubt there'll be much between the two.
 
Always used AS5 myself and never had a problem. Like the above post says if you give the HSF a couple of twists that will break the bond the AS5 makes.

AS ceramique is reported to be better for Phase change /-0c units.
 
think the ceramic has very slightly worse heat conduction properties but the plus side is it's impossible for it to conduct electricity. AS5 conducts heat slightly better but can be conductive under some circumstances.

not sure if i'm right but thats how I remember it.

as for sticky AS, I bent a few pins on a friends CPU while removing it, now I twist if possible and lift extremely slowly the HSF off any sign of CPU lift and I stop!

Fire..
 
Big.Wayne said:
I been reading a few horror stories about AS5 where after it has been applied and has time to set it forms a semi-permanent bond to the base of the heatsink. When people are removing the heatsink this bond is so strong that its pulling the CPU straight out of the socket and bending pins!

This just happened to my mate when removing his XP-120, pulled his Opteron clean from the socket! :eek:

ummm, that happens with ceramique aswell. the last two times i applied it to an a64 i pulled the cpu out of the socket attached to the heatsink. I think its the large surface area of the a64 heat-spreader that's to blame, not really what compoun you're using.


tbh though, there's bugger all in it. i've tried as5, as3, ceramique and now im using the generic crap that comes with my scythe ninja. They are all virtually identical i tell you, and even with the generic crap im STILL loading @ 48c @ 2.98ghx with my opteron 148.

FireBIade said:
think the ceramic has very slightly worse heat conduction properties but the plus side is it's impossible for it to conduct electricity. AS5 conducts heat slightly better but can be conductive under some circumstances.

not sure if i'm right but thats how I remember it.

as for sticky AS, I bent a few pins on a friends CPU while removing it, now I twist if possible and lift extremely slowly the HSF off any sign of CPU lift and I stop!

Fire..

Its not conductive, it's capacative. Not the same, but its still dangerous stuff near pins and motherboard traces.
 
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huh? AS5 doesn't form a bond

there is just a huge suction force because the two surfaces are very flat and all the air has been squished out.

it happens with all TIMs.

I have both and tbh they're more or less the same, ceramique will even out better than AS5 and is cheaper, so ceramique is the winner. (i want 12g ceramique tubes in UK... AS5 becomes cheaper if you buy a 12g tube)
 
thank you for the replies folks .Guess ill keep using the ceramique till it runs out then use the silver 5 .

needs a lot more paste on these a64 chips compared to my old socket 7 barton . so i guess ill be using the remains of my ceramiqe soon !

i have had the stuck cpu/heatsink problem with ceramique when i changed the AMD stock fam over to a thermaltake .Quite a shock when i removed the HS and the cpu came away with it , then noticed that the socket was still in the clamped down position. Luckily only 1 bent pin !
 
Never had any problems with it either,must have applied it hundreds of times,some times you just need a slight twist if the suction is too much

Never pulled a cpu from the socket though :eek:

Rob
 
I have, The p4 2.2a Im using now. Came right out of the socket with the heatsink when I was trying to get it off to try another cpu in the board. Nothing wrong with it, works perfectly. Had a little shock when I did it though.
 
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