best method to apply thermal compound?

Joebob

Joebob

Joebob

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What is generally considered to be the best method to apply thermal compound?

I have been advised to evenly spread the compound using a credit card to evenly cover the top of the cpu/gpu but I have also heard that this can cause air bubbles so you are best to place a small blob onto the die and let the pressure from the heatsink spread the compound!!!

Need advice quick as I have my laptop in bits ready to reassemble.
 
Ive attempted aplying it about 5 times trying to work out the best methoe, i came across spreading it is the best evenly not too much or little,

I tried making a line acorss where the CPU cores are, temps where like 48 degree's, Tried the dot method, was even worse i was getting 58 degree's
Then i tried evenly spreading it, i got 40 degree's then with burning in time now i get 38 degree's

i would use the spread method with a credit card.

Stefan. :)
 
I saw a video which showed different types, and the pressure was applied with a piece of perspex so you could see how even the spread was. I can't remember the video name though...

The blob works best. A small blob. It spreads out a lot. Also the blob has the least bubbles. Spreading it out causes inconsistent spreading when pressure is applied.

The X method seemed to work well too, but was a little wasteful.

So yeah, the blob :)
 
There are many methods and pros and cons to each. The credit card method has been a popular one for the past 10+ years or so but recently I used my finger to spread some artic silver 5 and it seemed to have worked as good as the credit card method.
 
Theres loads of methods, and personally I use the grain of rice blob in the centre.
I do remember before IHS came along the crdit card methid was favourits. Purely becasue you normally appplied with a mask over the top!
 
With your tongue

Seriously though it just doesn't matter very much, dot in the middle wins for ease of application. Peltier manufacturers recommend a 0.5mm layer, then put the block on and rotate clockwise-counterclockwise 10 degrees or so until you feel resistance, mop up the paste that's squirted out the sides and you're done. Can't say I can be bothered to do this though.
 
I tend to just use the line method theese days, though on my old lapped q6600 and lapped TRUE combo, i got slightly better results from spreading it with cling film on my finger.
 
I normally just put a small blob or line on and allow the gentle pressure of the heatsink being set down to spread it, whenever I remove a heatsink it always looks like it's spread evenly that way, and by doing this you avoid air bubbles. I don't think it matters too much either way as long as you are using a the right amount of paste.
 
I've tried to find out which method works best, and tbh, I witnessed absolutely no difference between spreading it out yourself, or using the line or blob methods...

I choose to spread it out manually.
 
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