Best way to apply thermal paste

lauy · 21 Jul 2016 at 13:47

Got the Matterhorn cooler. Wondering what the best way to do this was? Blob in middle then let heat sink spread it or a different way?

Thanks

foster grant · 21 Jul 2016 at 13:49

Myself I just use a blob in the centre

Robzere31 · 21 Jul 2016 at 13:54

I used to do the blob method but recently I just blob & spread it with an old credit card.
Seems to work Ok.

lauy · 21 Jul 2016 at 13:59

Yeah was debating whether to do the blob with heat sink or blob and spread with a card. I used to use the card spread method but most coolers have the thermal compound already on heat sink.

Banzai_Joe · 21 Jul 2016 at 14:13

Done both methods, not much in it really, more important to try not ot rock the HS onto the cpu. Its easy done, but that can negatively affect the spread of the paste.

lauy · 21 Jul 2016 at 14:17

Banzai_Joe said:
Done both methods, not much in it really, more important to try not ot rock the HS onto the cpu. Its easy done, but that can negatively affect the spread of the paste.

Basically try to plump it straight down, on top of it?

Banzai_Joe · 21 Jul 2016 at 20:23

lauy said:
Basically try to plump it straight down, on top of it?

lamboman · 21 Jul 2016 at 20:29

Technically speaking, a line with two dots is the best method, ensuring that the line is very, very thin to avoid applying too much thermal paste. This will give virtually perfect coverage over the entire IHS.

In reality, blob or above, it's going to make no meaningful differences whatsoever. So blob.

The-Plethora · 22 Jul 2016 at 08:40

This seems to be one of the most controversial topics on this forum

I always use the finger in a plastic bag technique, that was you can be certain you have got good full and yet thin coverage.

BluD · 22 Jul 2016 at 13:21

Yeah, its been tested loads of times, the only bad way to apply non conductive paste is if you sumhow manage to miss the chip all together, with conductive paste its a different story, ya just have to apply a very thin layer/small blob so it doesnt end up anywhere else except on the heat spreader/die.

PiKe · 22 Jul 2016 at 13:24

Small pea sized amount in the centre of the chip has never failed me.

SaTrOx · 22 Jul 2016 at 13:32

There is no best method just go with what you like

FloppyPoppy · 22 Jul 2016 at 14:12

Draw a smiley face.

doyll · 22 Jul 2016 at 17:09

The key is to get metal to metal contact with TIM filling any voids, not to put a layer of TIM between everything.

This is why I suggest a small dob in middle of CPU. All that is need is for it to press out into a circle just about to edges of IHS.

Also, if TIM is kinda hard, warm it up. Put it in a baggy with something to weight it down so it sinks below surface of some hot water in a bowl warms it nicely in a few minutes.

AdamScott85 · 25 Jul 2016 at 14:02

It doesn't much matter what way you add the paste, aslong as you don't add too much.

Glanza · 25 Jul 2016 at 14:20

I just use the blob method.

Some pastes i.e Thermalgrizzly will recommend you use the spreader to put a thin coating across the whole cpu but using the same paste doing the blob there's bugger all difference in temps.

Bonjour · 25 Jul 2016 at 20:01

I do a very thin line along the middle of the heat spreader.

archerz · 26 Jul 2016 at 08:56

blob for me. just as long as it covered the HS when compressed !

Artery · 26 Jul 2016 at 09:13

Blob for me too, but I didn't think it really mattered as much as some people think.

Bagnaj97 · 26 Jul 2016 at 11:27

Blob for me. In terms of quantity I've found that too little is definitely worse than too much so I tend to err on the side of caution. Sure, there's a sweet spot, but providing you're using a non-conductive paste then any excess (within reason) will get squeezed out and won't cause any harm.