I don't usually start new threads but I just had to share my experience with this stuff.
I currently have a 6600k @ 4.65GHz. I don't have a very good chip and need 1.45v to get it stable unfortunately. Therefore it's delidded and I've been trying to find a thermal paste to put onto the die to keep my temperatures under control.
I've been trying to avoid CLU (WHY?!) and tried other pastes:
Noctua NT-H1 - Massive pump out effect after just 1 day
IC Diamond - Seems to suffer from pump out effect just has a slower onset
AS5 - Thermal performance seems to drop off too
Anyway I picked up some CLU and applied it onto the die and I'll let the pics do the talking.
Diamond IC just after repaste:
Noctua NT-H1 1 day after repaste:
CLU just after repaste with Diamond IC ontop of the IHS:
The Diamond IC and NT-H1 performed almost identically just the Diamond IC seemed to take longer to pump out.
Now only time will tell if the CLU suffers any drop in performance but by looking at those temperatures so far I'm extremely impressed.
I currently have a 6600k @ 4.65GHz. I don't have a very good chip and need 1.45v to get it stable unfortunately. Therefore it's delidded and I've been trying to find a thermal paste to put onto the die to keep my temperatures under control.
I've been trying to avoid CLU (WHY?!) and tried other pastes:
Noctua NT-H1 - Massive pump out effect after just 1 day
IC Diamond - Seems to suffer from pump out effect just has a slower onset
AS5 - Thermal performance seems to drop off too
Anyway I picked up some CLU and applied it onto the die and I'll let the pics do the talking.
Diamond IC just after repaste:
Noctua NT-H1 1 day after repaste:
CLU just after repaste with Diamond IC ontop of the IHS:
The Diamond IC and NT-H1 performed almost identically just the Diamond IC seemed to take longer to pump out.
Now only time will tell if the CLU suffers any drop in performance but by looking at those temperatures so far I'm extremely impressed.
