Upon opening the memory out of the packet i noticed that the heatsinks on one end of the both memory modules where not stuck down properly. I have applied a reasonable amount of pressure to stick them back onto the chips.
Should i send them back as i don't know how long they will stick down for or how long they have been left like that in the warehouses. Will it affect the memory in any way as it seems to be sticking so far?
Should i send them back as i don't know how long they will stick down for or how long they have been left like that in the warehouses. Will it affect the memory in any way as it seems to be sticking so far?