Howdy. I am swapping my i7 13700k out on my gaming rig for an i9 14900k (will be donating the 13700k to my son's rig as part of an upgrade).
The issue is, I have a contact frame fitted to my motherboard and the last time I removed one of these, the CPU stuck to the cooler as I removed it and then the CPU dropped on the socket and bent a couple of pins which led to the motherboard being toast. Obviously want to avoid this in the future. Has anyone got any tips? I had thought to run a stress test to heat up the thermal paste to make it less like glue. Any other tips or tricks very welcome.
Thanks in advance.
The issue is, I have a contact frame fitted to my motherboard and the last time I removed one of these, the CPU stuck to the cooler as I removed it and then the CPU dropped on the socket and bent a couple of pins which led to the motherboard being toast. Obviously want to avoid this in the future. Has anyone got any tips? I had thought to run a stress test to heat up the thermal paste to make it less like glue. Any other tips or tricks very welcome.

Thanks in advance.