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- Joined
- 10 Sep 2006
- Posts
- 1,908
- Location
- UK
I'm gonna be building an M-ATX i7 860 rig soon, and I just wondered if all of the socket burn/poor pad contact issues with the Foxconn CPU sockets have been solved yet? I am looking to get an ASUS Maximus III GENE and I'm aware this board used the Foxconn CPU socket but I also heard it was just a few batches that had this problem?
So is the whole thing over and done with now or is there still stock flying around with the issue?
So is the whole thing over and done with now or is there still stock flying around with the issue?