Hi all,
H80i user and as we are in warmer weather I have brought my OC down from 4.5GHz to 4.2GHz and paid particular attention to my core temperatures. I've seen a big shift in temperature differential between the cores when under any stress. The example below is after running Prime but during gaming it will hit the high 60s/low to mid 70s on core 0 whilst staying in 50s/60s on core 3.
My first impression was that it was just the CPU silicon lottery in effect and a poorly applied TIM by Intel but it looks like I was wrong as taking the back off and actually looking at the backplate, I see it's installed upside down. Would these temperature differentials correlate to the picture of the backplate below? Or would a good enough seal still have been made chip side when it was fitted, I ask this is it was OCUK who installed this cooler on my behalf.
The obvious thing for me to do right now is switch it around but I have no thermal compound to reapply as I sent that in with the PC when the motherboard, CPU, cooler and ram got fitted in April.
So the stupid question which has to be asked even though I am certain the answer will be no is. Can I as a still swap it around and refit as is or is that a big no-no until I source some replacement compound, something which I can't get locally. See I said it was stupid.
Thanks in advance.
H80i user and as we are in warmer weather I have brought my OC down from 4.5GHz to 4.2GHz and paid particular attention to my core temperatures. I've seen a big shift in temperature differential between the cores when under any stress. The example below is after running Prime but during gaming it will hit the high 60s/low to mid 70s on core 0 whilst staying in 50s/60s on core 3.
My first impression was that it was just the CPU silicon lottery in effect and a poorly applied TIM by Intel but it looks like I was wrong as taking the back off and actually looking at the backplate, I see it's installed upside down. Would these temperature differentials correlate to the picture of the backplate below? Or would a good enough seal still have been made chip side when it was fitted, I ask this is it was OCUK who installed this cooler on my behalf.
The obvious thing for me to do right now is switch it around but I have no thermal compound to reapply as I sent that in with the PC when the motherboard, CPU, cooler and ram got fitted in April.
So the stupid question which has to be asked even though I am certain the answer will be no is. Can I as a still swap it around and refit as is or is that a big no-no until I source some replacement compound, something which I can't get locally. See I said it was stupid.
Thanks in advance.
