Help needed. Gigabyte Aorus X570S Master and LianLi Lancool 216 case.

VoOiTEC

VoOiTEC

VoOiTEC

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Joined
9 Oct 2023
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4
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Poland
Hello everyone,

Installed X570S Aorus Master motherboard into Lancool 216 chasis.

There is no space/gap between motherboard backplate and case. There is no pressure, bending and pulling. Components just slightly touching.

Is that "normal" and safe to use or it will cause problem/schortage?

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Cheers,
VoOiTEC
 
It looks a bit close, but I haven't got a Lancool. As you say the rear I/O looks fine. Perhaps someone with the same case can confirm, better safe than sorry.
 
Last edited:
VoOiTEC said:
There is no space/gap between motherboard backplate and case. There is no pressure, bending and pulling. Components just slightly touching.
Click to expand...

I'm really bad at looking at photos, but it looks like the backplate is too large, or the cut out is too small. What cooler are you using? If your cooler doesn't screw into the backplate, you can probably remove it.
 
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