IBM's new CPU Cooling ideas...

[Captain Fizz]

What do you think?

Watercooling built into the CPU packaging itself!
http://www.smalltimes.com/Articles/...ry=Manuf&PUBLICATION_ID=109&ARTICLE_ID=275807

To get better heat transfer from the core -> heatspreader:

A highly viscous paste is brought between the chip cap and the hot chip in order to reduce the thermal resistance. Thanks to its tree-like branched channels, the architecture allows the paste to spread very homogenously and attains a thickness of less than 10 micrometers. With this technique, two times less pressure is needed to apply the paste and a twofold increase in cooling performance can be achieved.

Also microscopic WC'ing:

The researchers are also developing a novel and promising approach for water-cooling. Called direct jet impingement, it squirts water onto the back of the chip and sucks it off again in a closed system using an array of up to 50,000 tiny nozzles and a tree-like branched return architecture.

Quite groovy if it starts appearing on CPU's...

 

[waso_dude]

seems like a good idea imo

 

[Defcon5]

sounds... expensive

 

[Jonny L]

Seems like a great idea, however, will it be any good for overclocking, what if they only make the system good enough for stock speeds?