IC-Diamond Air cooling thread

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17 Mar 2014
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241
Hello there;

I am your UK rep for IC-Diamond thermal paste and I am here to help as much as possible.

In order to make things more efficient we have decided to split the support into two section, in order to comply with the structure of ocuk forums.

Support in this section will be for when IC Diamond has been applied and air cooling has been used and then the same but for water.

Contests and giveaways will always be conducted under the Overclocking and cooling thread, rather than the water-based one.

Cheers all

Frost Dragon
 
AS copied from the watercooling thread, as it also applies here.

Right yours truly has been at it again.... no not that:p (ooh matron)

I am talking about using IC-DIAMOND with graphics card.

Case in point I was testing a ATI 6700 (ASUS) series graphics card and under (gpu fans set on auto) it was unusually high (whilst under 3dmark vantage) in temperature.

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So four quick screws later and to my shock i found this...........

Sorry for the bold line below folks, but it stresses on what I have been speaking of about TIM FAILURE during a high heat environment.

CLASSIC SIGN OF TIM FAILURE

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ON THE top right you can see where i have scraped off some of the TIM, which was bone dry and crumbled in my hands of which as you know should not happen. Also through out the GPU CORE we can see air bubbles. This is a classic sign of the paste's failure and spreading out (making voids or cracking) and thus spoiling temps.

So off we go and clean the blighter up:) I put a line down the middle and a couple of small blobs on either side.

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Temps before: on full load after one run 64c, after ICD 52C on full load.amb air temps as measured by my KELVIN probe ranged between 16.1 to 16.8c

Right I will edit this post with more results in a moment.

EDIT..

One old GTX 285 2GIG EVGA Model.

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Running with stock paste at 74C (full load amb temps at 16.6) gpu fan on auto.

One Kelvin probe i usually use during DICE OC sessions.

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Position of the probe in relation to the equipment.

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Let us pop off the HSFG shall we?

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OOOOOOOOH dear here we go again, some classic signs of TIM failure here, but not as bad as the ATI model.

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Note the only thing i changed was the TIM, and nothing else so the thermal pads were reused.

Now here is the method i use for LARGE gpu IHS, and this is also the EK 'approved' way too.



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Results from ICD from stock

68C (Down by 6c)
BRAND X 72c (Down by 2c)

THE correct and best method of application for 2011 PIN CPU's

note i did get a little carried away with the centre blob, however this method on larger IHS (CPU) is a great alternative way of insuring full coverage rather than just increasing the size of the blob in the centre.

DSCF71231024x768_zps9c430c46.jpg
 
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