Associate
- Joined
- 17 Mar 2014
- Posts
- 241
Thought I would throw my two penneth worth in here.
Please free to to take these views with a pinch of salt as i am biased as I work for a TIM company.
What We have found out is that small form factor and high heat environments (the ultimate of which are LAPTOPS) some TIM fail, specifically the standard TIm or PAD that is used. Anyone whom has done any laptop repair works will know that if you take off the CPU and GPU heatsinks and then remove the thermal pad, then more often than not the pad itself crumbles in your hands. The other case is when they use a TIM solution then you can see that the TIM layer has failed, that is a crack appears in the TIM layer or has dried out.
Many differing compounds offer certain temperature results, however very few offer reliability tests. Id-Est performance of the TIM overtime. So what I am saying is that temperature results are only half the equation, with the other half being reliability.
The question I am putting to you is if a Tim has been designed with LAPTOPS in mind (which are the ultimate test for high heat ) then one should bare that same thinking when using on a M-ITX case etc?
http://www.innovationcooling.com/reliability.html
Just something to bare in mind for your MATX/M-ITX systems folks.
kindest regards
Frost Dragon
Please free to to take these views with a pinch of salt as i am biased as I work for a TIM company.
What We have found out is that small form factor and high heat environments (the ultimate of which are LAPTOPS) some TIM fail, specifically the standard TIm or PAD that is used. Anyone whom has done any laptop repair works will know that if you take off the CPU and GPU heatsinks and then remove the thermal pad, then more often than not the pad itself crumbles in your hands. The other case is when they use a TIM solution then you can see that the TIM layer has failed, that is a crack appears in the TIM layer or has dried out.
Many differing compounds offer certain temperature results, however very few offer reliability tests. Id-Est performance of the TIM overtime. So what I am saying is that temperature results are only half the equation, with the other half being reliability.
The question I am putting to you is if a Tim has been designed with LAPTOPS in mind (which are the ultimate test for high heat ) then one should bare that same thinking when using on a M-ITX case etc?
http://www.innovationcooling.com/reliability.html
Just something to bare in mind for your MATX/M-ITX systems folks.
kindest regards
Frost Dragon
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