Intel changed the thickness of the substrate for its Skylake (6th generation) Core processors. However the thinner, less rigid structure could lead to many well known coolers damaging the chip and/or the motherboard, says a report by PC Games Hardware in Germany.
The report says that due to the chip's weaker supporting structure, the pressure exerted by a number of well known coolers is simply too much and is causing components to bend. The mechanically weaker CPU, its pins, and the motherboard contacts can all be bent and sheared by the pressure exerted by cooler clamping mechanisms. Even if that doesn't happen straight away, as you system sits on its desk, the moving of the system anywhere, if it receives any knocks or bumps in transit, could result in the structural ill-effects.
PCGamesHardware.de has discussed its findings with a number of key PC cooler makers and already received replies from most of them. The following feedback was obtained during the investigation:
http://hexus.net/tech/news/cpu/88628-intel-skylake-cpus-bending-due-cooler-mount-pressure/
The report says that due to the chip's weaker supporting structure, the pressure exerted by a number of well known coolers is simply too much and is causing components to bend. The mechanically weaker CPU, its pins, and the motherboard contacts can all be bent and sheared by the pressure exerted by cooler clamping mechanisms. Even if that doesn't happen straight away, as you system sits on its desk, the moving of the system anywhere, if it receives any knocks or bumps in transit, could result in the structural ill-effects.
PCGamesHardware.de has discussed its findings with a number of key PC cooler makers and already received replies from most of them. The following feedback was obtained during the investigation:
http://hexus.net/tech/news/cpu/88628-intel-skylake-cpus-bending-due-cooler-mount-pressure/