Ivy Bridge Temperatures Could Be Linked To TIM Inside Integrated Heatspreader: Report

[Twirlywoos]

PC enthusiasts with Ivy Bridge engineering samples, and reviewers at large have come to the consensus that Ivy Bridge is a slightly warmer chip than it should be. An investigation by Overclockers.com revealed a possible contributing factor to that. Upon carefully removing the integrated heatspreader (IHS) of an Ivy Bridge Core processor (that steel plate on top of the processor which makes contact with the cooler), the investigator found common thermal paste between the CPU die and the IHS, and along the sides of the die.

In comparison, Intel used flux-less solder to bind the IHS to the core on previous-generation Sandy Bridge Core processors. Attempting to remove IHS off a chip with flux-less solder won't end well, as it could rip the die off the package. On the other hand, the idea behind use of flux-less solder in CPU packages is to improve heat transfer between the die and the IHS. Using thermal paste to do the job results in slightly inferior heat transfer, but removing IHS is safer. One can be sure that making it safe for IHS removal couldn't have been the issue behind switching back to conventional thermal paste, as everything under the IHS isn't user-serviceable anyway, and off limits for them.

http://www.techpowerup.com/forums/showthread.php?t=164858

So based on what evidence we could find from our own investigation, as well as what experience has taught us, Ivy Bridge is running hot when overclocked because of TIM paste between the IHS compared to solder attach used on Sandy Bridge. Why Intel made this choice we aren’t yet sure. We also aren’t sure if they will continue using TIM paste on the Ivy Bridge line, or if this will only be seen on the Engineering Samples like the units sent out for review. However, we’ve put word out again to Intel and are waiting to hear back if they have any further insight or comment to offer. If nothing else, we can hope their reply will again be in good humor… “Secret Sauce” did give us a laugh!

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[Twirlywoos]

This is what happens when you try to remove the IHS from a chip that has solder instead of TIM.


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[Twirlywoos]

http://www.intel.com/content/www/us/en/processors/core/3rd-gen-core-lga1155-socket-guide.html

 

[Twirlywoos]

http://www.overclock.net/t/1248454/...egrated-heatspreader-report/170#post_17079860

Someone who de-lidded the CPU posted his results, but what is unknown is if he changed the mounting of the water block.

 

[Twirlywoos]

Thats good, its good to know that Intel using cheaper methods isn't the problem

Yeh, just need to verify if proper contact was made and what TIM he used. I would imagine from the posts at Overclock.net that Intel don't use regular of the shelf TIM and judging from charts it does make a difference in temps.

The plot thickens

 

[Twirlywoos]

The Tech Report was able to get a comment from Intel. It's not exactly conclusive, but does shed a little light.
http://kingpincooling.com/forum/showthread.php?t=1730&page=2

Curious, we asked Intel about the interface between the Ivy Bridge die and the heat spreader. Intel has confirmed to TR that Ivy uses a "different package thermal technology" than Sandy Bridge. The firm stopped short of answering our questions about why the change was made and how the thermal transfer properties of the two materials compare. However, Intel claims the combination of the new interface material and Ivy's higher thermal density is responsible for the higher temperatures users are observing with overclocked CPUs.

Intel also points out Ivy Bridge has a higher TjMAX specification, which governs when the CPU starts throttling in order to protect itself from heat damage. The cut-off for the Core i7-3770K is 105°C, while the 2600K starts throttling at 100°C.

http://techreport.com/discussions.x/22859

 

[Twirlywoos]

Wonder if they'll change this for Haswell, or even a revision of Ivy Bridge itself? Seems unlikely, but one can live in hope.

I pity the poor guy who buys one of these and jumps straight into slicing off the IHS only to find Intel changed their manufacturing process back to fluxless solder and he pulls off the core

It will be on the spec sheet as it was with Ivy.

 

[Twirlywoos]

Shameless bump

But can I use this:
http://www.overclockers.co.uk/showproduct.php?prodid=WC-350-EK

with my H100? As it does specify use with EK waterblocks. Note: for de-lidding only not lapping the IHS and putting it back on the dye.

 

[Twirlywoos]

liquid pro on the die and in between cpu cooler

can use mx4 inbetween the cooler if you want but best results would be with the pro

and no it wont hold the ihs down,best to just say its a delidded chip,the retention bracket clamps everything in place when using it

hi wazza

will the retention bracket on the h100 hold a de-lidded CPU down or will I need those screws linked above?

If not, the temperature difference with a lapped IHS is still impressive, so I will probably attempt this during next week too.

edit - I seem to recall discussions on 2 versions of the coollaboratory stuff, liquid pro and liquid ultra. OCUK seem to stock only the liquid pro. Is the Ultra better?