Lapped Tuniq Tower no change in Temps.

Clairvoyant · 7 Jan 2008 at 18:51

Hi

I lapped my tuniq, not the shine finish but good enough. (sorry no pics)

My temps have not changed.

It looked like I had good contact before lapping. And I checked the E4500 and the IHS was quite flat.

Should I lap the CPU or just leave it.

Stelly · 7 Jan 2008 at 18:54

no harm in lapping it mate, and you never know what it might do to your temps if you do

Stelly

Pneumonic · 7 Jan 2008 at 19:21

just beaware if you lap the E4500 you void its warenty

prosser13 · 7 Jan 2008 at 19:22

Are you using less TIM than before?

Clairvoyant · 7 Jan 2008 at 19:54

I am using Arctic Cooling MX-2 Thermal Compound.

I used the cling film over the finger tip, and had a thin cating all over the IHS.

Big.Wayne · 7 Jan 2008 at 20:35

Clairvoyant said:
I used the cling film over the finger tip, and had a thin cating all over the IHS.

Even though you are using a different TIM try the method below

Clairvoyant · 7 Jan 2008 at 23:24

Nope no difference.

Just a headache getting windows to boot. Bios resetting.

fingers crossed its all back running smooth.

WJA96 · 8 Jan 2008 at 07:28

There seems to be 2 issues with the Core2Duo/Quad IHS - one is that they are often not flat, and that is easily fixed by lapping. The other is that the cores themselves are soldered under the IHS and sometimes that isn't a continuous contact, so it actually can help to have the heatsink or waterblock 'bowed' so it presses down onto the cores.

I definitely don't want to reopen the whole Thermalright Ultra-120 discussion, but I'm using bowed waterblocks and they definitely work.

I only mention this as it may go some way to explaining why your temperatures haven't changed even though your IHS/HSF contact is significantly better post lapping.

Clairvoyant · 8 Jan 2008 at 10:26

The tuniq was flat just needed smoothing out.

Well Im happy with the temps so I will leave the IHS for now, as it under a week old.

helmutcheese · 8 Jan 2008 at 13:39

It the solder was not covering the whole surface of the Die(s) and you think a Curved Heatsink will press down on it, think again.

It would simply crush the Core if it was pressing down enough, its not going to move the solid solder, it would only help to press down a IHS onto the old type CPU's where there was TIM on top of the Die(s).

Its quiet possibly your Base was flat to start with.