On-Die Watercooling!

I saw that too - i wonder if it can be expanded to all silicon chips

So we could have stacked watercooled CPUs, GPUs and HBM :D
 
Then the gunk fills in the micro channels and you have a chip with air pockets and runs hotter than before!

Looks good but I don't know if it'll last long.
 
moogle said:
Then the gunk fills in the micro channels and you have a chip with air pockets and runs hotter than before!

Looks good but I don't know if it'll last long.
Click to expand...

properly treated and sealed from factory it should last indefinitely, but yeah this isn't something you'd want to add to a custom loop - you would need a heat exchanger that you could clean
how that have that there is a non-starter as a consumer product, even just the silicon seal could come away over time, it needs a lot of work to properly productise it
 
Last edited:
C&Ping from my dupe thread :o

I assume they used an FPGA so they could move the transistors out of the way of the channels. In CPUs/ASICs die space is at a premium.
Click to expand...

Maybe you could run it between the CPU & iGPU or maybe even in a blank layer in a 3D stack. I seem to recall hearing the research was already done on cooling those though, don't know what the solution was tho.
 
Last edited:
andybird123 said:
properly treated and sealed from factory it should last indefinitely, but yeah this isn't something you'd want to add to a custom loop - you would need a heat exchanger that you could clean
how that have that there is a non-starter as a consumer product, even just the silicon seal could come away over time, it needs a lot of work to properly productise it
Click to expand...

This.

However, cost saving procedures will cause complications further down the line I suspect.

Only time will tell I guess.
 
You must log in or register to reply here.
Back
Top Bottom