Hi
I renewed thermal compunds with Arctic 1mm pads on Asus p8z77-v pro mb. But I'm confused on two points.
1-) Did not use new pad strip shape. I splitted into small pieces according to mosfet sizes. Does it make problem ? Should pad encase all mosfet block ?
2- When removed MB chipset heatsink, it looked like thermal pad was used and i changed with new one. But in a lot of videos applying thermal paste. Which one correct ?
Please advice
Thanks
I renewed thermal compunds with Arctic 1mm pads on Asus p8z77-v pro mb. But I'm confused on two points.
1-) Did not use new pad strip shape. I splitted into small pieces according to mosfet sizes. Does it make problem ? Should pad encase all mosfet block ?
2- When removed MB chipset heatsink, it looked like thermal pad was used and i changed with new one. But in a lot of videos applying thermal paste. Which one correct ?
Please advice
Thanks
Last edited: