P8Z77-V PRO MB thermal compunds renewing

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1 Jun 2020
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Hi

I renewed thermal compunds with Arctic 1mm pads on Asus p8z77-v pro mb. But I'm confused on two points.
1-) Did not use new pad strip shape. I splitted into small pieces according to mosfet sizes. Does it make problem ? Should pad encase all mosfet block ?
2- When removed MB chipset heatsink, it looked like thermal pad was used and i changed with new one. But in a lot of videos applying thermal paste. Which one correct ?

Please advice
Thanks
 
Last edited:
To be honest either is fine. Thermal pads are good at filling gaps in uneven surfaces, which is why they're used for MOSFETs etc. Lots of separate chips on one heatsink.

The chipset will be ok too - if you're worried, measure the temperatures in HWMon or similar software :)

P.S. welcome to the forums!
 
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