Socket 2011 thermal paste question

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Hey Guys,

Please can you settle an argument, regarding 2011 (3820, 3930 etc) cpus and the correct thermal paste application method.

I believe that there is no difference between a line and pea sized amount where as my kind hearted mad brother believes a pea sized/thin layer spread is the best method.


Thought I would ask on the greatest forum on earth and get this settled - so I can go have a cup of tea! :)

Thanks!

Adam.
 
I used a pea size blob of artic mx4 in the middle of my 3820 and have absolutely no problems. I don't suppose it really matters but someone who has used the spread techniques may have a bit more info
 
I do spread, but only because the heatspreader is so dam big I want to ensure I'm covering right into the corners.
 
I used a pea size blob of artic mx4 in the middle of my 3820 and have absolutely no problems. I don't suppose it really matters but someone who has used the spread techniques may have a bit more info

+1, I always use a blob in the middle and the heatsink/waterblock to spread the paste. No matter what chip it is.
 
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