Up until now I have always spread thermal compound over the entire heatspreader/core however instructions seem to think its best to use a rice sized blob and let it spread out by itself over time?
Which one is best?
I use a paste simular to AS5, instructions here: http://www.ocztechnology.com/products/cooling_products/ocz_ultra_5-silver_thermal_compound
Which one is best?
I use a paste simular to AS5, instructions here: http://www.ocztechnology.com/products/cooling_products/ocz_ultra_5-silver_thermal_compound
