http://electroiq.com/blog/2013/12/amd-and-hynix-announce-joint-development-of-hbm-memory-stacks/
http://sites.amd.com/us/Documents/TFE2011_006HYN.pdf (MS PP)
AMD's HBM patent. http://www.google.com/patents/US20130346695
Bryan Black, Sr Fellow and 3D program manager at AMD noted that while die stacking has caught on in FPGAs and image sensors “..there is nothing yet in mainstream computing CPUs, GPUs or APUs” but that “HBM (high bandwidth memory) will change this.” Black continued, “Getting 3D going will take a BOLD move and AMD is ready to make that move.” Black announced that AMD is co-developing HBM with SK Hynix which is currently sampling the HBM memory stacks and that AMD “…is ready to work with customers.”
http://sites.amd.com/us/Documents/TFE2011_006HYN.pdf (MS PP)
3 Options after GDDR5
•GDDR5 Single-ended I/O
- Max. 8Gbps with same power
•GDDR5 Differential I/O
- Max. 14Gbps with much more power
•HBM
*
(Wide I/O with TSV)
- Lower speed with many I/Os and low power
AMD's HBM patent. http://www.google.com/patents/US20130346695