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How you are going to fit a cooling fan on this is out of my league.... Efficient heat dissipation is going to be a very hard problem to overcome, IMO.
could have something between the layers?You would be looking at much lower heat levels in the future though, 11nm chips will put out a lot less heat than current chips.
yep thats it.
I remember reading about this as well a while back on the forum. Believe it was Intel who used tiny tubes within the processor to liquid cool from within. Not sure what exactly happened to it or if its still be researched

