Thermal Compound Application

[Narj]

Am I right in saying that a large rice grain or small pea-sized amount in the centre of the CPU cover is the correct way to apply TIM? Looking at the manual for my Silver Arrow it mentions applying compound to both the CPU and the contact surface, which, IMO makes no sense.

Sorry for the stupid question but I've watched so many Youtube videos of people using the credit card spreading method that I wonder if I'm going mad...

 

[Narj]

OK Cheers chaps... I'd have thought that the blob in the centre would have filled pits as the pressure pushed it outwards anyhow. I've never been a fan of the credit card method as it's likely to leave air bubbles IMO. Same goes for pre-applied TIM as well, surely?

I've got some Akasa TIM remover in case it doesn't work well anyhow.

 

[Narj]

How do you mean?

Credit card method - I'd have thought that pushing a machined surface down onto an uneven layer of TIM would result in the TIM equivalent of an Aero.

A bit like trying to put a screen protector on a phone in one go rather than from the edges...