Thermal Compound

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I understand that this is supposed to take the heat away from the CPU but if your already at the maximum thermal dissipation of the heatsink your using, it won't make any difference.

Is my logic correct?
 
I understand that this is supposed to take the heat away from the CPU but if your already at the maximum thermal dissipation of the heatsink your using, it won't make any difference.

Is my logic correct?

Anything beyond maximum thermal dissipation would imply a thermal runaway. Or in short things would just keep getting hotter and hotter until everything melts or burns out. So the reality is within your average PC the heatsinks do not operate at anything close to this.

EDIT, But yes the logic you use is sound. It is just that is not why the past is used.
 
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eh nope, The two surfaces of both the IHS and the HSF have tiny pits of imperfections. The compound ensures maximum conductivity even where there are these imperfections. It basically fills those pits.

My guide here explains this :

http://www.huddysworld.co.uk/index....g-tim&catid=40:techie-talk-hardware&Itemid=72

I initially tried following this guide but it was giving me temps of 70*C+ while Prime95'ing out of the case.

I then tried doing a quick and dirty strip down the vertical of the CPU and my temps are not around 65*C while prime95'ing so clearly it does matter how you apply it.

This is with the CPU at stock using the stock thermal compound that comes with the Scythe Kozuti (don't know how good it is). I'm still getting a fairly large (~5*C) variation between the cores though.

What is the best method for my i7 3770k?

Also I noticed some scratches on the base of the CPU cooler and the cpu which weren't there when I bought them, wonder what could have caused that.

EDIT

Also, whilst I'm on the subject, what sort of temps should I be maintaining?
 
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Remember that too much as just as bad as having none at all. Bear in mind that it's only to fill those in-perfections so assist in the contact. However, if the IHS or the surface of the HSF block aren't level, then you may not be getting full contact between the surfaces. This is common where one core is variably higher in temperature than the others.

I would certainly look at maybe an alternative cooler just to see if the problem is with the HSF. If you have scratches, then that won't help. Filling these with thermal material won't help. Otherwise, if you think it's the IHS and you're seriously not happy then it maybe worth contacting to the supplier. Altenatively, you could consider lapping, which is the process of "levelling" the IHS but this does void any warranty. Try a different cooler first.
 
Don't try to get all cores the same it's almost impossible, because of the layout of the cores on the die you'll have 2 abit further away from the thermal diode so in effect will be cooler.

and as the software used to give core temps is a calculation of the average that this diode put's out it's not 100% full proof any way. IMO 5 deg c +or- across 4 cores is acceptable. My 3570k has around 5-8 deg difference under custom H20 with my Arctic Silver (still the best!) 5 still bedding in but slowly the difference is coming down. You'll notice the differential when idle mostly, when you load her up under IBT or Prime the temp difference will be 2-4 deg c at most.

My advice don't worry too much about it and enjoy that CPU.
 
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Does anyone have a picture which points out where the cores are then and where I need to ensure the best contact?

What sort of temperatures should I be looking at for running at stock - full load?
 
Does anyone have a picture which points out where the cores are then and where I need to ensure the best contact?

What sort of temperatures should I be looking at for running at stock - full load?

Try to get away from where the cores are etc the important thing is to get good contact with IHS. The die on Ivybridge is vertical on the chip IHS so a good thin vertical line of TIM is best. If the cores were all at the top or all at the bottom you wouldn't compensate for this by applying more pressure unevenly to one area of the IHS it would be counter productive. the IHS has direct contact with the Die and the IHS needs good even contact with the CPU Cooler this will allow the heat to pass through with the maximum efficientcy.

Stock temps I can't comment as I don't know sorry.
 
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