Thermal Paste Application on Haswell-E?

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Just received my new build components, and it's occurred to me that as the 5820K CPU is pretty large, so I'm not sure on the best method of applying the TIM that came with the Noctua NH-D15. Is the 'pea size blob in the middle' method still recommended, or another method?
 
Really? I'm sure I read of someone comparing these methods, and concluding that the 'pea-sized spot in the middle' technique gave the best coverage.
But then that may've been with a smaller CPU.

I'm very interested to hear the consensus on this as I too have just got a 5820K and have been wondering the same thing!
 
Der8aurer has done a recent video here: https://youtube.com/watch?v=qc7bCC1TmVg

I have also had over 300 separate mounts on various Intel sockets this year alone, and for me the thin line down the middle or two diagonal lines crossing worked best on LGA 2011-3 IHS with heatsinks or waterblocks alike.

Pretty handy video, thanks for that. The X method looks the best to me based on that, I'd probably keep a bit farther away from the corners than in the video. I think the cores on the 5820k go down the left and right sides of the CPU, so it makes sense to try and reach these areas with the TIM. I assume left and right is in relation to the writing on the heat spreader?
 
Typing this on my new system, all went well with the CPU installation using the X application method, temps are good at stock, now to investigate overclocking!
 
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