my new kit comes tomorrow and im trying to find out the best way to apply my IC Diamond thermal compound?
does it matter what kind of CPU it is? (were to put the compound)
do i need to leave it to settle?
do i do a pea size blob?
do i do a rice size blob?
do i spread it?
do i do a line?
do i do a cross?
or do i not spread it??
AAHHHH!!!
ive read up about it and everyone seams to have a diffrent idea how to do it :/
IC Diamond say to apply "approximately 5.0-5.5 mm bead on center"
should i just go with this??
does it matter what kind of CPU it is? (were to put the compound)
do i need to leave it to settle?
do i do a pea size blob?
do i do a rice size blob?
do i spread it?
do i do a line?
do i do a cross?
or do i not spread it??
AAHHHH!!!
ive read up about it and everyone seams to have a diffrent idea how to do it :/
IC Diamond say to apply "approximately 5.0-5.5 mm bead on center"
should i just go with this??