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Thermal paste??

If (and ever you do decide to use paste not on the stock cooler) I wouldn't suggest spreading it about yourself. This can cause airbubbles in the TIM (pretty much causes more trouble than it's worth) it's much safer to just let the cooler pressure out the pea sized blob instead.

That's good to know :)
 
If (and ever you do decide to use paste not on the stock cooler) I wouldn't suggest spreading it about yourself. This can cause airbubbles in the TIM (pretty much causes more trouble than it's worth) it's much safer to just let the cooler pressure out the pea sized blob instead.

If you have enough TIM to get air bubbles then you are using too much...
 
No need to spread it at all. The even pressure of the cooler onto the chip will spread it better than you'd ever manage yourself.
 
Think about it for a minute.

If you spread it or not, it still gets the same pressure from the cooler. The difference being, putting a pea in the middle just might not be enough to reach all parts of the die/cooler.
The same amount used but spread evenly then mounted is a guarantee that you applied it properly. :)

Let me stress that using that much that you could spread it by lightly holding a credit card and spreading it like butter is not what I'm talking about here. I've tried it both ways and it's proven over years.

Both ways work but saying one doesn't just because it's not the way you do it is not right.
 
Think about it for a minute.

If you spread it or not, it still gets the same pressure from the cooler. The difference being, putting a pea in the middle just might not be enough to reach all parts of the die/cooler.
The same amount used but spread evenly then mounted is a guarantee that you applied it properly. :)

Let me stress that using that much that you could spread it by lightly holding a credit card and spreading it like butter is not what I'm talking about here. I've tried it both ways and it's proven over years.

Both ways work but saying one doesn't just because it's not the way you do it is not right.

I actually read someones hard work on how to spread TIM (actually several peoples hard work) And all conclusively came out to the fact spreading the TIM can come off worse than using a pea sized and allowing the cooler to spread it. Also I wasn't saying it was wrong just that it can be worse.
 
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I actually read someones hard work on how to spread TIM (actually several peoples hard work) And all conclusively came out to the fact spreading the TIM can come off worse than using a pea sized and allowing the cooler to spread it. Also I wasn't saying it was wrong just that it can be worse.

Yeah fair enough. There are tests for both, I (and several others) have got more consistency by spreading. They both work :p

Now....

AMD vs INTEL???? :D
 
I'd go for some IC Diamond it's one of the top 5 thermal pastes around. There should be a thread from a while back where someone tested the entire range of OCUk thermal paste. :p (though the MX was one of the top 5 as well if I remember right)

Thumbs up, I've tried loads of pastes and ic diamond is definitely one of my top, I'm using it on my newest build also and it works like a beast.
 
Watch this video and you'll understand why you shouldn't spread the TIM yourself. Cloudstomp take note, your logic isn't logic at all.
Small pea sized blob is the way I'd recommend. You'll get air bubbles if you spread it.

 
Watch this video and you'll understand why you shouldn't spread the TIM yourself. Cloudstomp take note, your logic isn't logic at all.
Small pea sized blob is the way I'd recommend. You'll get air bubbles if you spread it.


No offense but if the paste is spread by a moron who leaves holes in the paste before he puts the glass (CPU) on then he deserves air bubbles :D

Edit: Perhaps I should have included a disclaimer. "Those who have the brains they are born with can spread TIM." If you struggle tying your own shoelaces then please use the pea method just incase"
 
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No offence taken. And hopefully you won't take offence at me pointing out that most regular system builders use a pea sized blob.
Easier to quote than type it myself:

"The Reason i Stick behind this method is because, When you apply the paste in the center of the cpu and exsert force equaly, the paste is spred evenly and forced into the textured surface between the Heatsink and Cpu. (Thats Why lapping a Cpu Brings the Temp down because you Removing a Layer of metal and evening out the rough texture of the cpu)
So if you just Spreading you will then get Uneven patches of thermal past that when the heatsink is put on it sits with patches that are not making Contact with the Heatsink.
"


Mind you, maybe the air bubbles don't matter if you're not pushing your proccessor. ;)

EDIT: That's why my CPU is lapped and I use the blob method. Thanks. And I can also tie my own shoelaces. Maybe you tangle yours up and think it makes sense?
 
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No offence taken. And hopefully you won't take offence at me pointing out that most regular system builders use a pea sized blob.
Easier to quote than type it myself:

"The Reason i Stick behind this method is because, When you apply the paste in the center of the cpu and exsert force equaly, the paste is spred evenly and forced into the textured surface between the Heatsink and Cpu. (Thats Why lapping a Cpu Brings the Temp down because you Removing a Layer of metal and evening out the rough texture of the cpu)
So if you just Spreading you will then get Uneven patches of thermal past that when the heatsink is put on it sits with patches that are not making Contact with the Heatsink.
"


Mind you, maybe the air bubbles don't matter if you're not pushing your proccessor. ;)

EDIT: That's why my CPU is lapped and I use the blob method. Thanks. And I can also tie my own shoelaces. Maybe you tangle yours up and think it makes sense?

Ok then.

There are far more important things to worry about....really.
Gillywibbles thread is becoming more tempting by the minute.
 
Just looked at this thread......this escalated slightly...haha!

I think i'll just let the heatsink spread it, if I actually use some that is. I might just stick with the stuff they supplied,and they have not told me to use any paste...

Cheers for the suggestions though! :)
 
As per the arctic silver on a new or freshly cleaned cpu and block/sink

http://www.arcticsilver.com/pdf/appmeth/int/vl/intel_app_method_vertical_line_v1.1.pdf

Tint by spreading with a cc first clean excess then use the line method. I tend to tint the cpu and the heatsink as i am a believer in filling the gaps on both ends.

These guys have been making top 10 thermal products for years i suspect they know what they are talking about
 
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I used to use arctic silver 5 for a long time and only now with my new current build I am using IC diamond. Both thermal compounds are great but from the tests i've done with these few I found the diamond to be the one for me :D
 
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