Thermal pastes with C2D

mcgriffo · 20 Mar 2007 at 22:56

Just wondered what people's thoughts were on the application technique for paste with the C2D CPUs?

The reason I ask is that I know Arctic Silver now recommend a very thin line down the middle with a twist to spread, rather than the "grain of rice and spread with card" style.

I'm going to use Chill Factor instead and feel that maybe I should just stick to the original, time served technique. The Arctic Silver argument may be due to a consistency in their mixture peculiar to them.

Anyway..... thoughts?

mcgriffo · 21 Mar 2007 at 15:37

Now either:

a) No one has gone C2D yet or
b) No one uses thermal paste

Struggling with my belief system for either of these options...

MikeHunt79 · 21 Mar 2007 at 15:40

I'm still using an Athlon-XP, but i'd try both methods, and see which ones works best.

Simmy · 21 Mar 2007 at 15:41

I personally use the 'spread with a card' technique as twisting never spreads it out properly for me. Try testing both techniques if you want to find out for sure.

matja · 21 Mar 2007 at 15:42

More = better. tbh.

Cob · 21 Mar 2007 at 16:24

matja said:
More = better. tbh.

W T F

Ak!ta · 21 Mar 2007 at 16:30

matja said:
More = better. tbh.

OMG

ROFL

Alexrose1uk · 21 Mar 2007 at 16:48

Ak!ta said:
OMG

ROFL

Hahahaha.

I usually go more for work a tiny little bit onto the surface of the cpu, with my finger in some plastic so theres a tiny thin layer over the entire chip massaged/polished on, then put a small (quarter/half pea size) blob right in the centre, so that the fan cooler will pressurise the tiny central blob into any cracks and gaps over the chip so theres a decent all over coating.