Associate
- Joined
- 11 Mar 2008
- Posts
- 882
- Location
- Earth:\UK\Chelmsford
I can understand why lapping a slightly convex/concave CPU can improve temps as the flatness increases the surface contact with the heat sink thus increases the heat transfer.
Presumably therefore, it follows that if you lap the chip you need to lap the heatsink in order to maximise the surface contact.
Currently running 1.5V through chip in sig and load is roughly 59C max.
Would like to achieve 3.6GHz on air, I can currently do it but temps and vCore go through the roof and are unacceptable.
Would it be worth lapping my chip/TT to achieve a higher clock or would it solely improve temps at current clock?
Presumably therefore, it follows that if you lap the chip you need to lap the heatsink in order to maximise the surface contact.
Currently running 1.5V through chip in sig and load is roughly 59C max.
Would like to achieve 3.6GHz on air, I can currently do it but temps and vCore go through the roof and are unacceptable.
Would it be worth lapping my chip/TT to achieve a higher clock or would it solely improve temps at current clock?