TSMC 5nm EUV fab. process more advanced than Intel's 10nm in 2022?

[g67575]

I've been reading on a website called wikichip that 10nm would be the last non EUV process for companies such as Samsung. I assume this means 10nm or above generally uses the DUV process instead?

Does this also mean that Intel's 10nm fab process will be less advanced, and (potentially) have lower transistor density than fab processes like TSMC's 5nm EUV process, due to having fewer layers in the CPU die material?

If this is the case, I wonder if this explains Intel's desire to move on from their 10nm fab. process, to 7nm (apparently EUV), even after the many years they've spent developing the fab process technology for desktop 10nm chips (likely in 2022).

 

[Grim5]

It's a good question

intel has confirmed tsmc will be making i3 models on 5nm next year for intel while intel uses its 10nm for i7 and i9

we can do a lot of speculation as to why this is, but if the two processes aren't about equal it can create some very interesting numbers - for example if tsmc 5nm is vastly better you could end up with the i3 having the best single core performance and easily beating a i9 - but of course in this case Intel can just attempt to nerf the i3 with very low power limits in its bios

 

[Mesai]

Yea, Intels process has limits as the die gets smaller; there are too many duds per wafer so they’ve been doing this stacked architecture and producing 14nm+++++++ chips. They have to move their fab over to compete.