Folks,
I've been around the overclocking world for a few years now, I've had a couple of High-End air setups, and a couple of Water-Cooled rigs too.
Having just decided to move on from my Q6600 rig, as in sig, I've been looking at the Socket 1366/Socket 1156 debate, and many boards, to try & find a suitable rig. I'm sure you all know the pro's & cons of both i860/i920, but the cooling attached to the boards seems to be causing me some serious grief :/
Looking at a couple of 1156 boards;
Asus P55D Evo
Gigabyte UD3-R
They both have the chipset incredibly close to the GPUs, or Underneath, making a chipset block impossible.
In addition; looking at lower end X58 Boards;
Asus P6T SE
Gigabyte X58 UD3R
They both seem to have heat pipe connected Mosfet coolers, making chipset cooling again difficult.
I realise there are things like the full cover chipset/mosfet blocks for the X58 UD5, but thats a £200 board, with £100 of single use block attached. Are the manufacturers deliberately making this awkward, or is it simply a by product of the current design from Intel?
Has watercooling finished a transition from the value conscious, building rigs to extract all possible performance for as little cost as possible; to the rich & image conscious due to over capitalisation?
I've been around the overclocking world for a few years now, I've had a couple of High-End air setups, and a couple of Water-Cooled rigs too.
Having just decided to move on from my Q6600 rig, as in sig, I've been looking at the Socket 1366/Socket 1156 debate, and many boards, to try & find a suitable rig. I'm sure you all know the pro's & cons of both i860/i920, but the cooling attached to the boards seems to be causing me some serious grief :/
Looking at a couple of 1156 boards;
Asus P55D Evo
Gigabyte UD3-R
They both have the chipset incredibly close to the GPUs, or Underneath, making a chipset block impossible.
In addition; looking at lower end X58 Boards;
Asus P6T SE
Gigabyte X58 UD3R
They both seem to have heat pipe connected Mosfet coolers, making chipset cooling again difficult.
I realise there are things like the full cover chipset/mosfet blocks for the X58 UD5, but thats a £200 board, with £100 of single use block attached. Are the manufacturers deliberately making this awkward, or is it simply a by product of the current design from Intel?
Has watercooling finished a transition from the value conscious, building rigs to extract all possible performance for as little cost as possible; to the rich & image conscious due to over capitalisation?