What thermal paste do you think will be better?

[MadMacs]

This

"Thermalright 'The Chill Factor"
Thermal impedance :0.047

or this

"General Features:

Special Properties: High conductivity; Low bleed; Stable at high temperatures

Type: Silicone Fluid with 5% Metal Oxide and 5% Copper

Thermal conductivity: >1.729 W/m-k

Thermal resistance: >0.06 C-in2/w

Dielectric Breakdown: >5.0 KV ac

Manufacturer: STARS"

I have got both but am unsure of what one to use

 

[Gerard]

For all the hype about artic silver etc theres probably only a couple of degrees difference between that and regular compound. Either of the 2 would be fine, or you could try one and see what the load temps are like, clean it off the heatspreader then try the other to see what gives better temps.

 

[MadMacs]

For all the hype about artic silver etc theres probably only a couple of degrees difference between that and regular compound. Either of the 2 would be fine, or you could try one and see what the load temps are like, clean it off the heatspreader then try the other to see what gives better temps.

Could do, bit of messing around though

 

[mattup]

I would use the thermalright stuff.

Or ditch both and get some AS5!

glad to be of help

Matt

 

[clone]

Aye AS5 for da win.

 

[WJA96]

AS5, assuming you can't get the Shin-etsu stuff.

 

[MadMacs]

Are you talking about "AK-TC 5022" ?

Will this really make much of a difference?

 

[scooby555t]

artic sliver 5 m8

 

[WJA96]

Are you talking about "AK-TC 5022" ?

Will this really make much of a difference?

No - you want the Shin-etsu MicroSi which is truly superb, but almost impossible to get hold of. AS5 is fine though. I wouldn't bother with anything else. The Thermalright stuff comes free with Thermalright coolers and it's good if you get it for free, but I wouldn't spend money on it over AS5.

 

[w3bbo]

Shin-Etsu microSI - got some on my cpu and it is marginably better than AS5. Nothing to write home about but if you want the absolute best temp then this is the stuff to get imo.