Your preferred TIM application method.

Soldato
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I'm currently running some tests on my newly acquired 2500k before I lap it.

I noticed the delta between the hottest and coolest core is 10 degrees at idle, this is with the centre spot method letting the heatsink spread it out itself.

As it'll be coming off again I was wondering what peoples suggestions would be for a more even delta t across all cores?

Thanks.
 
Fine layer of coollabs liquid metal is my preferred paste. No conventional paste gets near it.
 
Used AS5 for a while, I apply a very short line that more like resembles a blop, but a bit "longer" cause the haswell core is like, "Long". Never spread by hand, just let the cooler spread it.
 
So does the actual thermal paste matter? I've had MX2 for years although it's nearly empty and i'm about to get a new CPU so is there anything better on the market?
 
Most aren't designed to be spread by hand though tbh the difference will be minor but thats more likely to result in air bubbles, etc. there are some pastes which are designed to be spread like the gelid though.

For core 2's I used to use a line (which is also the way most of the makes recommend as being optimal - lab tested) but bit out of touch with the best way for modern i7s, if in doubt use the blob method.

I'm a bit old school and still rocking the AS5 in a lot of cases though sometimes use MX2/4.
 
@nick, very true. Though you can remove clu with an isopropyl jet wash. Back on mx4 though on the chip in sig. Gonna reapply though as temps are a bit oddly spread at 100% load. Ok in games at 64-66c @4.7.
 
I've been using noctua nh-1 recently instead of my AS5 stable mate. Especially on naked GPU cores as it's non-conductive. I'm gonna try the line method next I think. I'll double check which direction for my specific chip. Thanks all.
 
Well as rep for ICD and as a private user , when using ICD I tend to go by the following rules:

Socket 775 to 1366 size

use this method.

5-5_zps6922e9dc.jpg


2011 pin and 2011 pin -3 size use this method

DSCF71231024x768_zps9c430c46.jpg


GPU (LARGE IHS ) use the same format as 2011 pin

naked GPU core use this:

DSCF71211024x768_zps0da34a4e.jpg


These are our recommended ways to address this issue.

Cheers

Frost Dragon
 
I usually use a blob in the middle and after taking 2 pcs i built 6 years ago apart recently the thermal compund had spread out covering virtually all the IHS. I used the blob method again as i can't see how a line would cover any extra space.
 
My dads way - spread as thinly as possible with debit card or something similar ,

My way - pea sized dot in the middle and run stress test software for a wee while .

Both do the job but have noticed differences with each chip depending on how concave the heat spreader is , usually with practice I would say the spread method is most effective

I use ic diomand , about 2-3 c cooler than anything else I've used inc mx-4
 
@frostdragon

That seems like loads of TIM!

The only time I've put similar amounts to that on I ended up wit TIM everywhere! I know go with a small vertical line (die dependant) about the size of a grain of rice.
 
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