I purchased this along with the rest of my recent upgrade and i am just about to start overclocking but i've checked the temps and the two cores are abour 46 degress idle! I was under the impression this beast should bring them down to 30 and below or there abouts?
My setup is:
E2140 @ 1.6ghz
2gb OCUK 6400 ram
320 samsung spinpoint HD
Gigabyte GA_P35C_DS3R
450 watt VX Corsair Power Supply
(need more just ask!)
This could be due to a number of things, the main one i'm guessing is the seatin of the fan itself. I found this to be an absolute bitch to install! It took hoursg! Eventually i got it in a tightened the screws and it was solid in but the screws were still able to tighten but i was scared of it damaging the mobo. So i guess the question is "Should i just keep tightening until all the screws are in solid?"
The next thing it could be is the thermal compound layer, i think i may have used too much: I put on about a rice grain amount and tried to spread it with a plastic card but it got stuck to the card (its consistency was rubbish
) So i put a bit more on just to try and get a full thin layer but it kept getting stuck to the card. In the end i put about 2 rice grains worth on and squashed the cooler on top of it... So my next question: Should i attempt to take as much compound off as i can and re-apply?
The third thing it could be is that due to the size of the fan i had to remove my case fan (it physically won't fit!) Could this really make this much difference?
So in conclusion am I expecting too much from the fan to cool to 30 degrees? (i hope not becuase so far my max overclock is a whooping 1.7GHZ!!!!!
)
Thanks in Advance!
My setup is:
E2140 @ 1.6ghz
2gb OCUK 6400 ram
320 samsung spinpoint HD
Gigabyte GA_P35C_DS3R
450 watt VX Corsair Power Supply
(need more just ask!)
This could be due to a number of things, the main one i'm guessing is the seatin of the fan itself. I found this to be an absolute bitch to install! It took hoursg! Eventually i got it in a tightened the screws and it was solid in but the screws were still able to tighten but i was scared of it damaging the mobo. So i guess the question is "Should i just keep tightening until all the screws are in solid?"
The next thing it could be is the thermal compound layer, i think i may have used too much: I put on about a rice grain amount and tried to spread it with a plastic card but it got stuck to the card (its consistency was rubbish

The third thing it could be is that due to the size of the fan i had to remove my case fan (it physically won't fit!) Could this really make this much difference?
So in conclusion am I expecting too much from the fan to cool to 30 degrees? (i hope not becuase so far my max overclock is a whooping 1.7GHZ!!!!!

Thanks in Advance!