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- Joined
- 19 Nov 2008
- Posts
- 304
I want to do one of the two, lapping will be much easier but if there is a reasonably improvement with removing the Intel heat sink I will consider it. Atm I am on air cooling but will be moving to wc soon. What sort of temp drops are common for each of them?
Also when the heat sink has been removed do you have to be really careful with thermal paste as the chip is now exposed and could short circuit? Or have they covered up any bare pins/component legs?
thanks for any input
Also when the heat sink has been removed do you have to be really careful with thermal paste as the chip is now exposed and could short circuit? Or have they covered up any bare pins/component legs?
thanks for any input
