Could someone explain to me what lapping is exactly...
I understand its where you apply sandpaper to a CPU and sand away until you reach the copper base... but what I don't understand is that if it makes a good temp difference (around 5C), why isnt it done as standard, instead of Intel/AMD making a big fat metal base that collects heat?
I understand its where you apply sandpaper to a CPU and sand away until you reach the copper base... but what I don't understand is that if it makes a good temp difference (around 5C), why isnt it done as standard, instead of Intel/AMD making a big fat metal base that collects heat?