New Lian Li V series 2010

C64

C64

Soldato
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http://www.techpowerup.com/123059/L...ew_Cases_to_be_Launched_at_Computex_2010.html
Anyone welcome the comeback of these cases ? doesn't look like there's too many holes for cable management and are those pictures the final product ?
74c.jpg

74d.jpg
 
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Yea I have always wanted a big v series like this but they were always out of reach financially.
Have to say this looks the dogs apart from motherboard tray holes, what's going on at Lian Li ? about time they included cut outs for cables in their trays right ?
 
Couldnt agree more about cable holes, one thing thats missing on a lot of their cases, i have seen a few of their midi cases that feature cable cut outs, but sadly theyve skimped in this department on their full towers.
 
Well i think this case pictured no idea what it is but probably £200 + not too much to ask to have a few holes.

Still want one though :D
 
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Isn't having a big metal support running down it going to put off enthusiast and modders that like to show off their gear?

I mean I assume it is removable, but even so they could design it a bit better for what I assume is their main market.
 
Considering the price of some of their latest cases, this may be more like £300+, and still no cable tidying options, recently they released the A77F full tower, (£270.00), not much better than the current A71F/A70F but a heck of a lot more money. Another example of crazy pricing is this.

http://www.overclockers.co.uk/showproduct.php?prodid=CA-193-LL&groupid=701&catid=7&subcat=187

£184.00 for a midi case, bit mad tbh, its basically a shrunken A70F with a window and black internals.
 
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Crickey, that makes my A70F look tiny.
Optical illusion, it's very close to same size:
Front HDD cage is same "seven HDD high" and it has five 5.25" bays.
Instead of second PSU position/HDD cage+second exhaust fan above motherboard that space is combined to motherboard area. (similar to A77F)

Considering todays PSUs aren't any major heat producers unlike in time of Antec P180's design process that division above PSU is really redundant extra complexity.
Cooling wise door's design is now lot better than in old V-serie cases whose door had only few small slots for intake airflow and there's now at least one active intake into area with huge majority of heat production.
But that exhaust area could use one top exhaust above CPU: Now only exhaust fan is ~10cm below top and heat which gets above that level can't get out easily because warm air tries to rise upwards. (vs. second rear exhaust creating backwards+out draft)

Sure good for those users of (nonstandard) wannabe standard electric heater-base motherboards this will do but for probable price tag and those few design drawbacks I don't see this as good alternative to A70/71 design for those using standard components.
 
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