I was being Ironicul

But, yes you did mean maths

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Tessellation is one of the areas they have talked about boosting performance in with these cards.
Don't expect a massive performance boost - tho you might see it in some areas/benchmarks - this round is more about making things work more efficently, better balancing the card so that some areas aren't held back by others, boosting performance in some DX11 and eyefinity scenarios and so on.
They have lots of room.
5870 die size is 334 (mm squared)
480 die size is 529
So even if they shoot for a die size of 450, to be safe on power and heat, that's still plenty of potential.
Add in the more mature process, and that this is a new architecture, and it's looking possible they can produce a 6870 that can get close to a 5970 and certainly beat the 480 hands down.
The only potential issue I see is if they have to increase the memory bus to 384 bit if 256 creates too much of a bottleneck.
Higher clock rates and a more efficient process says it is possible. I don't care what others would prefer or expect performance wise from new cards, it's my opinion only, from my experiences with current tech at stock and overclocked.
They have lots of room.
5870 die size is 334 (mm squared)
480 die size is 529
So even if they shoot for a die size of 450, to be safe on power and heat, that's still plenty of potential.
Add in the more mature process, and that this is a new architecture, and it's looking possible they can produce a 6870 that can get close to a 5970 and certainly beat the 480 hands down.
The only potential issue I see is if they have to increase the memory bus to 384 bit if 256 creates too much of a bottleneck.
They won't be using a more efficient process though. They are using the same process as the previous cards.