How to apply thermal compound ?

sydeccles

sydeccles

sydeccles

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I am thinking of reseating my Zalman CNPS9700 as according to Core Temp on my Q6600, Core 0 is circa 4 or 5 degrees C hotter than the other 3 cores.
My question is, how do you guys apply your thermal compound, a grain of rice size blob and swivel the CPU cooler or a diagonal strip across the CPU, or is there a 3rd option
Thanks
Syd
 
With the quad core you should have a line. On my Q6600 I had the grain of rice method & the weight of the,cooler to push it down.
As for temp, you expect a few degrees between cores.
 
Can I please ask, what is the best method of applying thermal paste to the new breed of CPU coolers that do not have a one piece convensional heat sink, such as the Akasa Venom AK-CCX-4002HP.

http://www.akasa.com.tw/update.php?tpl=product/cpu.product.tpl&no=181&type=CPU coolers&type_sub=Retail cooler&model=AK-CCX-4002HPV2
AK-CCX-4002HP_g07.jpg


I ask as I have just ordered one along with some MX-3.

Syd
 
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they are known as DCHP

direct contact heat pipe

i suggest putting a little more paste on than you need. doing a test mount then removing the cooler.

make sure you have good contact and no air pockets where the heatpipes meet
 
I was going to use 4 small blobs, one in the centre of each of the tubes. I am installing this cooler on a Q6600 and was a tad concerned that I may not get a good enough covering across all 4 cores.

The instructions on the Arctic Silver Web state a Horizontal Line, just hope that the cooler line method marries up, e.g not a vertical line

Syd
 
Usually for a Q6600 use a thin line going right to left vertically centered through the text on the IHS... all other methods will have inferior results tho to what degree is another matter.

However for those DCHP jobbies as rjkoneill said (and he should know) you need to use more paste than is normal and for best results you probably get better results with a thermal pad (tho don't use the Coollaboratory or other liquid metal based ones unless you know what your doing ;) ).
 
Lapped is a different story, as you've smoothed out some/most of the imperfections that can cause issues if manually spread, tho even then I'd be suprised if it produced better results then the line method, I'd still expect it to produce less than optimal coverage and air bubbles.
 
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Difference was 1-2c Rroff, both the cooler and the cpu were lapped. Used the line method though on the q9550 i had and my current i7 920.
 
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