i5 2500K Temps + Applying Thermal Compound

[TW]Fox

[TW]Fox

[TW]Fox

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Hi guys,

Just swapped my Asus P8P67 Pro for an Asus P8Z68V Pro.

My CPU temps appear to be up about 5c across the board - load and idle. It now full loads at 70c or so.

The CPU is stock, previously it was OC'd to 4.5Ghz without issue.

I'm trying to work out whats happened. My main thought is that I've somehow bodged the thermal compound bit. I'm using AS5 - what is the best way to apply this?

Thanks!
 
Try the credit card method, AS5's consistency means you can get an ultra thin layer and as long as the base of your cooler is flat it will give you best performance. Give it a test application, mount the cooler then take it off again to see if you get complete contact over the centre of the chip.

If you don't then you'll need to use the blob method to give you a thicker layer.
 
I used the thin line method on the AS5 website. Was this not the best plan?

I think I've only got enough left for one more application :(
 
Well the line or blob method is the safest as it'll guarantee that you get full contact, but it might cost you a degree or two in performance so no major biggy.
 
Pea sized (~5.5mm) blob is the best option.

Allow the weight of the cooler to spread it.

Avoids any air bubbles that will increase the temp.

:)
 
[QUOTE='[TW]I'm using AS5 - what is the best way to apply this?
[/QUOTE]

Does your HS have exposed heatpipes on the base?

If it does there's a full description on the artic silver webise giving application instructions - though they aren't very comprehensive.

But below is a post i did on another thread explaining the process:

plec said:
Advice for applying AS on exposed heatpipes on the base only:

If you have exposed heatpipes (ridged surface) you could try tinting the surface of the heatsink first to fill in the voids made by the exposed pipes on the base (artic silver 5 advises this but i've used this method with other gunk if i felt the heatsink required it.). You're basically filling the gaps, created by the exposed pipes, but scrape of all the excess so the base of the heatsink only has a very slight tint of gunk (credit card is great for this). The theory is that it fills, the sometimes pretty large, gaps that exposed heatpipes can cause on the base of the heatsink.

After tiniting the heatink you then only need to apply a single line (less than a mm thick) down the middle of the core (vertically) - but don't go from edge to edge leave a 5mm gap at each end.

This method should ensure that the pipe gaps don't suck up all of the gunk on the cpu and allow it to spread as it would on a shiny flat heatsink base.
Click to expand...

If it's a shiny, flat based HS, as the others have already mentioned, rice/pea size blob is usually the best method.
 
Last edited:
Just reclocked it back to 4.5Ghz and the temps barely change. Occasionally touches 70 under full load.

Any concern?

Immediatly drops back to 38c as soon as I go back to 0% load.
 
Sounds fine, the difference between the temps before and after the board change might be the way they measure temperatures and nothing to do with the thermal compound application.
 
Temps will be coming straight off the CPU, might be that the voltage measurements are slightly out between the two boards and it's actually running at a higher voltage than previous?
 
Jokester said:
Temps will be coming straight off the CPU, might be that the voltage measurements are slightly out between the two boards and it's actually running at a higher voltage than previous?
Click to expand...

True but I've seen differences, VID variations aside, usually between makes but I wouldn't rule it out.
 
I've just done the same as you, returning a B2 P8P67 Pro & got the P8Z68-V Pro to replace it.
My temps are exactly the same between both boards.

Maybe its the AS5 as they recommend 200 hours curing time on the stuff.
I'm using IC Diamond paste.
 
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