Best way to apply Thermal compound?

Moothead2

Moothead2

Moothead2

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What is the best way to apply thermal compound to a CPU; place a pea size dot in the centre of the chip and then spread by placing the heatsink on top of it or spread a thin layer evenly over the chip before placing the heatsink on?

Thanks.
 
I always used to spread it as I was worried that it wouldn't spread very well from a dot in the middle, although now I always go for a blob in the middle and it spreads nicely, I get slightly better temps that way also.
 
i would never recommend covering the cpu plate end to end. A blob or pea-sized blob would be sufficient and then the left heat sink do the rest.

You need to remember that cpu cores do not cover the entire plate but are centrally located under the plate, about 2-4mm wide depending on how many cores there are.
 
Arclite said:
You need to remember that cpu cores do not cover the entire plate but are centrally located under the plate, about 2-4mm wide depending on how many cores there are.
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Although this is true, the heat spreader is a good conductor and its job is to spread the heat from the core; the more contact between this and the HS the better. :)

I'm not saying smother your CPU in TIM but a blob that just about doesn't reach the edge of the CPU is probably the most practically efficient... probably.

have fun
 
I will always "prime" the heatsink & heatspreader before the main aplication by rubbing thermal paste into the surface and wiping away all the excess. My reasoning is that it wil help fill any tiny imperfections. Probably does nothing though...
 
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Onyx said:
My reasoning is that it will help fill any tiny imperfections. Probably does nothing though...
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That's effectively what the TIM is for. It fills small manufacturing defects and any gaps where the plates aren't flat to improve the contact area between the CPU and the sink. Sticking a blob in the centre is proven to work, as allowing it to spread from a point like that prevents air bubbles being trapped as can happen if the paste is spread around. :)
 
True. Makes me think its helping though :)

I was once asked by a mate to have a look at his pc cause it wouldn't post. Whipped off the HSF to discover he'd used nearly half a tube of AS5. As this was back in the day of Barton 2500's, the paste had spread off the exposed core and onto the PCB, probably shorting something... :D
 
Whichever method you use short of a poor contact or using margarine you're unlikely to see any difference whatsoever from a temperature perspective.
 
I remember reading a review somewhere of someone testing things like toothpaste... There wasn't much more than 5 degrees or so difference between any of them, the only problem with toothpaste, is it dries out, and then it isn't as good :P
 
R.C.Anderson said:
I remember reading a review somewhere of someone testing things like toothpaste... There wasn't much more than 5 degrees or so difference between any of them, the only problem with toothpaste, is it dries out, and then it isn't as good :P
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Most solidy liquidy things conduct better than air, it's just that they either dry out or create smells under heating.
 
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