Corsair 350D Build watercooling question

babysnakes33 · 18 Mar 2014 at 20:49

Up & coming new rig.
I'm thinking of using the OcUK Tech Labs Fathom All in One Custom Cooler with the Hardware Labs Black Ice SR1 240 rad in the front of the case in push pull config (bringing cool air in from outside) & using the rear case fan as intake too. Also adding a Hardware Labs Black ICE Radiator GT Stealth 240 - XFlow into the roof in an exhaust fashion(only two fans) .The loop will run from (CPU) Eisberg pump to SR1 240 (front mounted) & then up to the Stealth 240 (roof mounted) & back to the pump. No GPU cooling included.

Any thoughts on this flow direction?

I'll be using a Intel Core i7-4770K on an Asus Z87 MAXIMUS VI GENE.

Thanks in advance.

b0rn2sk8 · 18 Mar 2014 at 21:33

Seems overkill to be honest, but loop sequence makes little to no difference in overall temps so just go with what fits best and in your case it makes zero difference due to only having 3 components.

If you go with both rads, ditch the push pull, all it will do is make more noise with little to no reduction in temps.

babysnakes33 · 18 Mar 2014 at 22:06

My Air 540 is near silent with a Glacer 240L in push/pull. Yes it's a bit overkill on the above question but i've heard Haswells run a tad on the hot side. Got a 3820 in this at the moment running at 4.6Ghz idle temps are high 30's & fully loaded about 60. Just want to see what is possible. I'm going to be using an Icy Dock in the lower ODD bay to house a slimline BluRay drive & two WD Scorpio Black 2.5" 750GB 7200RPM in RAID 10 with a Samsung 256GB SSD 840 PRO as an OS drive "nailed" somewhere into the back of the case.

daveip · 20 Mar 2014 at 09:46

babysnakes33 said:
i've heard Haswells run a tad on the hot side.

Not by design ... it's due to their crappy way of attaching the heat spreader to the die. You'll want to delid. Doesn't matter how much cooling you have, unless you can get the heat off the die as efficiently as possible.

Avenged7Fold · 20 Mar 2014 at 12:39

My 4770k does 4.6 without de-lid, so i suppose its luck of the draw whether you need to de-lid to go that high.

Lapping the IHS improves contact between the block and IHS considerabbly and doesnt require a vice or a hammer to be taken to the chip, just a bit of sand paper. It is relatively low risk in comparison (though i would say de-lidding is low risk in itself if done responsibly anyway).