Soldato
- Joined
- 28 May 2007
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http://techreport.com/news/26336/gl...ung-process-tech-grants-amd-access-to-finfets
http://www.brightsideofnews.com/2014/04/17/samsung-and-globalfoundries-collaborate-on-14nm-finfet/
Interesting stuff. Could give amd a boost in Gpu's and Cpu's. Sounds like this kind of process tec could close the gap that Intel currently enjoy.
http://www.brightsideofnews.com/2014/04/17/samsung-and-globalfoundries-collaborate-on-14nm-finfet/
Interesting stuff. Could give amd a boost in Gpu's and Cpu's. Sounds like this kind of process tec could close the gap that Intel currently enjoy.
Perhaps the biggest beneficiary of this licensing deal will be AMD, who gains access to a capable 14-nm FinFET tech for the production of its future CPUs and SOCs. AMD's Kaveri APUs actually ran slower than their predecessors after transitioning from GloFo's 32-nm SOI process to 28-nm bulk silicon. Meanwhile, AMD competes most directly with the process tech leader, Intel.
The tech being licensed is the next major step forward, a 14-nm process that uses a new transistor structure known as FinFETs or, as Intel calls them, tri-gate transistors. Intel made the transition to FinFETs at its 22-nm process node and saw some fairly dramatic benefits in terms of switching speed and power efficiency (which are often two sides of the same coin in process tech discussions). Other firms in the industry have struggled to reap the usual power and speed benefits when moving below 28-nm process geometries without FinFETs. Most of these firms have scheduled FinFETs for the 16- or 14-nm nodes, with several delays. Meanwhile, even Intel has delayed its 14-nm process due to technical difficulties.
Samsung appears to have succeeded in developing a capable 14-nm FinFET process. Here's how the press release describes the technology being licensed:
Developed by Samsung and licensed to GLOBALFOUNDRIES, the 14nm FinFET process is based on a technology platform that has already gained traction as the leading choice for high-volume, power-efficient system-on-chip (SoC) designs. The platform taps the benefits of three-dimensional, fully depleted FinFET transistors to overcome the limitations of planar transistor technology, enabling up to 20 percent higher speed, 35 percent less power and 15 percent area scaling over industry 20nm planar technology.
"This unprecedented collaboration will result in a global capacity footprint for 14nm FinFET technology that provides AMD with enhanced capabilities to bring our innovative IP into silicon on leading-edge technologies," said Lisa Su, senior vice president and general manager of Global Business Units at AMD. "The work that GLOBALFOUNDRIES and Samsung are doing together will help AMD deliver our next generation of groundbreaking products with new levels of processing and graphics capabilities to devices ranging from low-power mobile devices, to next-generation dense servers to high-performance embedded solutions."
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Better feedback in the CPU section I reckon though 
