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4670K with no lid

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6 Feb 2010
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Hi, i have just got an de-lidded 4670K from the MM and i am thinking of running it without the lid instead of refitted the lid with better tim, What the best TIM for this?

If this is not advised OR run the risk of damaging the CPU when is the best TIM for under the IHS.

i was thinking liquid metal pad without the lid?
 
Liquid metal from the syringe, ultra or pro. You apply a tiny drop onto the CPU die and spread it out. Don't get any on the pcb or the strip of vrm's. However, to run without an ihs on you need a delid die guard to prevent the die from being crushed. And as far as I'm aware theese kits are only available for waterblocks
 
Yes, though its hard to remove. Again you need very little on the ihs. Small drop in the centre and brush it out to the edges. Don't overdo it with this stuff, if any gets into the socket its bye bye mobo and CPU.
 
Yes, though its hard to remove. Again you need very little on the ihs. Small drop in the centre and brush it out to the edges. Don't overdo it with this stuff, if any gets into the socket its bye bye mobo and CPU.

on the google's, i see there is big drops putting this stuff on the die, but only 1c or 2c when putting it on the IHS and i dont this that's worth the risk of killing the cpu mobo and a gpu if i over do it.

i think i will use the pro on the die and some MX on the cooler, then maybe the pro when i fit a new water block in a few week
 
P4Clock, aren't you water cooled? If you have a EK Supremacy you could get the naked Ivy mounting kit and run with the IHS off.

Mine currently has CLP between the chip and IHS with MX4 between the IHS and block but will soon be naked. I am not letting CLP anywhere near my block though so will be using Gelid Extreme.
 
P4Clock, aren't you water cooled? If you have a EK Supremacy you could get the naked Ivy mounting kit and run with the IHS off.

Mine currently has CLP between the chip and IHS with MX4 between the IHS and block but will soon be naked. I am not letting CLP anywhere near my block though so will be using Gelid Extreme.

Running air on new rig for a week or two but will be adding water at some point. Can you link me to the mount. Or send me a trust with the info.
 
Sorry for the late reply, been busy. Here you go. Picture only shows 3x nylon washers but should be 4. The first one I ordered only turned up with 2x washers and 3x legs. A quick email to Bailey and I had a replacement kit the next day free of charge. If you order a kit and it turns up with anything missing give me a shout as I have a spare couple of legs and washers now. It's out of stock here but a quick look around shows it's available elsewhere.

There's a quick review of one here. Only a extra 3 degrees off but it all helps.
 
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I am now running my 4670K with the EK Naked Ivy mounting kit so bare die. If anything my temps seem to have increased a little so I am considering going back to putting the IHS back on the cpu. I noticed the die on the 4670K is offset to the left of centre so is now not fully under the jetplate of my block and am unsure if this is what's causing it. It's supposed to get colder again over the next few days so I will see where things stand then before making a decision.
 
There's no real reason to go direct die, so much easier and safer to refit the IHS with CLP. Raystorm CPU blocks can be fitted direct die if you want with out the naked ivy kit.

I used CLP on both sides of the IHS which does make a mess of the surfaces so if I was to do it again I'd probably use MX on the waterblock.
 
There is no need to use a die protector (shim), once all processors were made this way.

You just need to be careful fitting the block / heatsink and making sure it is square to the die. It should be more effective as the heat goes directly to the cooling face rather than through the IHS and one additional layer of paste.
 
There is no need to use a die protector (shim), once all processors were made this way.

You just need to be careful fitting the block / heatsink and making sure it is square to the die. It should be more effective as the heat goes directly to the cooling face rather than through the IHS and one additional layer of paste.

True, but a lot more chips bit the dust back then than now due to ham-fistedness.
 
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